Create highly integrated products with a smaller package and increased functionality
Semiconductor industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. Amkor’s SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. By assembling, testing and shipping millions of SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test.
Amkor’s Center of Excellence for substrate-based SiP technology is located in our largest volume manufacturing facility in ATK4 Kwangju, South Korea. The large-scale manufacturing capabilities in ATK4 factory can achieve significant volume production support with very high yields with short cycle times.
Amkor Technology defines advanced SiPs as multi-component, multifunction products in an IC package. They require high-precision assembly technologies, which leverage Amkor’s strengths.
- Size reduction
- Ultra-thin package
- Thin substrate with core and coreless using finer line and spacing
- Conformal and compartmental shielding
- Low filler size for mold underfill
- Fine pitchflip chipandcopper pillar
- Double side assembly
- Test developmentand production test
- Turnkey solution
System in Package technology allows multiple advanced packaging technologies to be combined to create solutions customized to each end application. Laminate based SiP technology is in a front-runner solution and most popular SiP solution for cellular, IoT, power, automotive, networking and computing system integrations.
Existing market uses for SiP include:
- RF and wireless devices
Power amplifiers, front-end module, antenna switch, GPS/GNSS modules, cellular handset, and cellular infrastructure, Bluetooth®solutions, 5G NRAntenna-in-Package(AiP) - IoT for Wearable and Machine to Machine (M2M)
Connectivity,MEMS, microcontroller, memory, antenna, PMIC, and other mix-mode devices - Automotive applications
Infotainment and sensory modules
- Power Modules
DC/DC converter, LDO, PMIC, battery management and others - Logic, analog and mixed-mode technology
Tablets, PCs, display and audio - Computing and networking
5 g网络和调制解调器,数据中心,存储和SSD - Extension of the technology platform to a wider field of application areas is ongoing
AiP/AoP (5G NR) SiP Solutions
Millimeter-wave (mmWave) radio design with beamforming and array antenna will be used in varieties of Advanced SiP products for 5G cellular system. Millimeter electromagnetic wave design is imposing a new challenge for the system designers, components and SiP packaging engineers.
Key Amkor Packaging Technologies for AiP/AoP
- Greater than 26 GHz achieved
- Compartmental shielding using laser trench and paste filling technology
- Partial (selective) conformal shielding
- Partial molding
- Body size: up to 23.0 mm x 6.0 mm
- Substrate layer counts: up to 14 layers
- Low loss and low dielectric substrate
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